Semiconductors and 3D Stacking Expert Witness

Expert Qualifications

This highly qualified expert has over 20 years of experience in his field, with demonstrated experience with semiconductors, ROM, DRAM, SRAM, 3D stacking, and signal interfaces. He earned his BA in electrical engineering at Union College before completing his MS in electrical engineering and PhD in material science at the University of Vermont. He has he's several roles throughout his career including being a senior research and development scientist at IBM Microelectronics, the director of technical marketing at Innovative Silicon Inc., the IP strategy director at Rambus Inc., and the memory development engineer at Invecas Inc. Most recently, he served as an adjunct professor of semiconductor physics at the University of Vermont.